Hollow shielding structure for different types of circuit elements and manufacturing method thereof

ABSTRACT

A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit under 35 U.S.C. §119(e) of a U.S.Provisional application filed on May 4, 2016 in the U.S. Patent andTrademark Office and assigned Ser. No. 62/331,630, and under 35 U.S.C.§119(a) of a Korean patent application filed on Aug. 25, 2016 in theKorean Intellectual Property Office and assigned Serial number10-2016-0108435, the entire disclosure of each of which is herebyincorporated by reference.

TECHNICAL FIELD

The present disclosure relates to a hollow shielding structure fordifferent types of circuit elements and a manufacturing method thereof.More particularly, the present disclosure relates to a hollow shieldingstructure for different types of circuit elements which include anelectromagnetic wave shielding member capable of simultaneouslyprotecting semiconductor chips or various types of circuit elements fromexternal environments and shielding the elements from electromagneticwaves, and a manufacturing method thereof.

BACKGROUND

In recent years, demands on portable apparatuses have been rapidlyincreasing in electronic product markets and thus miniaturization andweight reduction of electronic components mounted on the portableapparatuses are increasingly needed. Technology for reducing individualsizes of mounting components and semiconductor package technology forintegrating a plurality of individual elements into one package areneeded to realize miniaturization and weight reduction of electroniccomponents. For example, semiconductor packages which handle a radiofrequency (RF) signal need to be miniaturized, as well as to includevarious electromagnetic wave shielding structures to realize goodelectromagnetic interference (EMI) or electromagnetic wave immunitycharacteristics.

As the related electromagnetic wave shielding structure is applied tosemiconductor packages, a structure which covers various types ofelements with a shield can formed of a metallic material andpress-processed, and a structure which covers all elements with aninsulator and includes a shielding layer formed on the insulator aredisclosed.

In response to the shield can of the shielding structures in the relatedart being used, the shield can may be directly soldered to a ground padof a printed circuit board (PCB). Accordingly, in response to the shieldcan being separated from the PCB to reuse various circuit elements andthe PCB, a ground pad patterned in the PCB may be detached or damaged.Accordingly, it may be difficult to reuse the various circuit elementsand the PCB.

In response to the insulator of the shielding structures in the relatedart being used, the frequency characteristic of the element may bechanged due to a difference of a dielectric constant between theinsulator and the air. In response to the circuit element package beingapplied to various products or different models, a structure for RFsignal matching or a technical treatment corresponding thereto may benecessary. Accordingly, the use of the circuit element package may berestricted and additional costs according to the structure for RF signalmatching or the treatment may be incurred.

The above information is presented as background information only toassist with an understanding of the present disclosure. No determinationhas been made, and no assertion is made, as to whether any of the abovemight be applicable as prior art with regard to the present disclosure.

SUMMARY

Aspects of the present disclosure are to address at least theabove-mentioned problems and/or disadvantages and to provide at leastthe advantages described below. Accordingly, an aspect of the presentdisclosure is to provide a hollow shielding structure for differenttypes of circuit elements without change in a frequency characteristicof an element and a manufacturing method thereof.

Another aspect of the present disclosure is to provide a hollowshielding structure for different types of circuit elements which uses apolymer comprising a metal filler as a shielding material and is formedthrough high-speed dispensing and a manufacturing method thereof.

Another aspect of the present disclosure is to provide a hollowshielding structure for different types of circuit elements that isreusable by applying an easily reworkable shielding structure and amanufacturing method thereof.

In accordance with an aspect of the present disclosure, a hollowshielding structure for different types of circuit elements is provided.The hollow shielding structure includes a printed circuit board (PCB) onwhich at least one element is mounted, a shield dam surrounding theelement, and a shield cover configured to be electrically coupled to anupper portion of the shield dam, and cover the element, with a gapformed between the element and the shield cover.

In an embodiment of the present disclosure, a step may be formed in aportion of the shield cover. The step may be formed in the portion ofthe shield cover close to the shield dam. The step may be formed alongan edge portion of the shield cover.

In an embodiment of the present disclosure, a height of the shield covermay be smaller than that of the element.

In an embodiment of the present disclosure, the shield dam and theshield cover may be electrically coupled through a conductive adhesionunit.

In an embodiment of the present disclosure, a plurality of slots inwhich the adhesion unit flows may be formed in the shield cover.

In an embodiment of the present disclosure, a plurality of seatingportions including a first portion in contact with the upper portion anda side of the shield dam and a second portion bent from an edge of thefirst portion may be formed in the shield cover and the plurality ofslots may be formed in the plurality of seating portions.

In an embodiment of the present disclosure, the plurality of slots maypenetrate the first portion or may simultaneously penetrate the firstportion and the second portion.

In an embodiment of the present disclosure, the adhesion unit may belocated between the shield dam and the shield cover.

In an embodiment of the present disclosure, the shield cover may beformed of a conductive metal material.

In an embodiment of the present disclosure, the shield cover may includea conductive tape attached to the shield dam and a shape maintenancelayer configured to maintain a shape of the conductive tape.

In an embodiment of the present disclosure, at least one air dischargehole may be formed in the shield cover.

In an embodiment of the present disclosure, the shield dam may be formedof a conductive material and may be coupled to a ground pad formed inthe PCB.

In an embodiment of the present disclosure, the shield dam may becontinuously or discontinuously coupled to the ground pad formed in thePCB.

In an embodiment of the present disclosure, the shield dam may be ashield dam formed through three-dimensional (3D) printing and may havean aspect ratio that a height of a cross section in the shield dam islarger than a width of the cross-section.

In accordance with another aspect of the present disclosure, a hollowshielding structure for different types of circuit elements is provided.The hollow shielding structure includes a PCB on which at least oneelement is mounted, a shield dam surrounding the element, a shield coverconfigured to be spaced from a top of the element and covers theelement, and an adhesion unit configured to electrically couple theshield dam and the shield cover. In an embodiment of the presentdisclosure, a step may be formed in the shield cover so that a portionof the shield cover which is in contact with the shield dam is locatedlower than a remaining portion thereof.

In accordance with another aspect of the present disclosure, a methodfor manufacturing a circuit element package is provided. The methodincludes loading a PCB on which different types of circuit elements aremounted into a working position, calibrating a position of a nozzle withrespect to the loaded PCB, forming a shield dam on the PCB bydischarging a material from the nozzle, placing a shield cover in anupper portion of the shield dam to cover the different types of circuitelements, and forming an adhesion unit which electrically couples theshield dam and the shield cover.

In an embodiment of the present disclosure, the calibrating of theposition of the nozzle may include setting a discharge start position ofthe nozzle by detecting a distortion degree of the PCB on an X-Y planeto a clockwise direction or counterclockwise direction with respect to apreset manufacturing position, and setting a gap between a surface ofthe PCB and an end portion of the nozzle by detecting a distortiondegree of the PCB on the X-Y plane to a Z-direction.

In an embodiment of the present disclosure, the method may furtherinclude, after the forming of the adhesion unit, removing the adhesionunit from the shield dam and the shield cover, separating the shieldcover from the shield dam, removing the shield dam from the PCB,removing a remaining portion of the shield dam attached to the PCB.

Other aspects, advantages, and salient features of the disclosure willbecome apparent to those skilled in the art from the following detaileddescription, which, taken in conjunction with the annexed drawings,discloses various embodiments of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certainembodiments of the present disclosure will be more apparent from thefollowing description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1A is a cross-sectional diagram illustrating a hollow shieldingstructure for different types of circuit elements according to anembodiment of the present disclosure;

FIG. 1B is a graph explaining change in a frequency characteristic dueto a dielectric constant according to an embodiment of the presentdisclosure;

FIG. 2 is a schematic cross-sectional diagram illustrating an examplethat a height of a shield dam is formed lower than a height of anelement mounted on a printed circuit board (PCB) according to anembodiment of the present disclosure;

FIG. 3 is a diagram illustrating an example of an underfill treatmentbeing performed between a bottom surface of an element and a top surfaceof a PCB according to an embodiment of the present disclosure;

FIG. 4 is a perspective view of a shield cover of FIG. 1A wherein theshield cover includes a plurality of slots, in which an adhesion unitflows, in a contact portion with a shield dam according to an embodimentof the present disclosure;

FIG. 5A is a diagram illustrating an example that a hole is formed in ashield cover to prevent frequency interference of an element accordingto an embodiment of the present disclosure;

FIGS. 5B and 5C are diagrams illustrating examples that a hole and astep are formed in shield covers in response to a height of an elementbeing larger than those of the shield covers according to variousembodiments of the present disclosure;

FIG. 6 is a perspective view illustrating another embodiment of theshield cover illustrated in FIG. 4 according to an embodiment of thepresent disclosure;

FIG. 7 is a block diagram illustrating a material discharge device forforming a shield dam and an adhesion unit of a hollow shieldingstructure for different types of circuit elements according to anembodiment of the present disclosure;

FIG. 8 is a diagram illustrating a moving route of a nozzle inputthrough an input unit provided in a material discharge device accordingto an embodiment of the present disclosure;

FIG. 9 is a diagram illustrating a discharge hole of a nozzle of amaterial discharge device through which a material for forming a shielddam is discharged according to an embodiment of the present disclosure;

FIG. 10A is a diagram illustrating a state that a material for forming ashield dam is discharged through the nozzle illustrated in FIG. 9according to an embodiment of the present disclosure;

FIG. 10B is a diagram illustrating an example that a plurality of shielddams having different heights are formed through the nozzle illustratedin FIG. 9 according to an embodiment of the present disclosure;

FIG. 11 is a cross-sectional diagram illustrating an example that ashield dam having different heights is formed in both sides of a PCBaccording to an embodiment of the present disclosure;

FIG. 12 is a cross-sectional diagram sequentially illustrating amanufacturing process of a hollow shielding structure for differenttypes of circuit elements according to an embodiment of the presentdisclosure;

FIG. 13 is a diagram illustrating an example of a ground unit beingpatterned in a PCB in a discontinuous hidden line form according to anembodiment of the present disclosure;

FIG. 14 is a diagram illustrating an example that a ground unit ispatterned in a PCB in a continuous solid line form according to anembodiment of the present disclosure;

FIG. 15 is a perspective view sequentially illustrating a manufacturingprocess of a hollow shielding structure for different types of circuitelements according to an embodiment of the present disclosure;

FIG. 16A is a perspective view illustrating mounting equipment formounting a shield cover on a PCB according to an embodiment of thepresent disclosure;

FIG. 16B is a diagram illustrating a reel cartridge provided in themounting equipment of FIG. 16A according to an embodiment of the presentdisclosure;

FIG. 16C is a diagram illustrating a plurality of shield covers attachedto a film unit of the reel cartridge of FIG. 16B at intervals accordingto an embodiment of the present disclosure;

FIG. 17 is a diagram illustrating an example that a shield cover isplaced in a shield dam through a robot arm provided inside mountingequipment according to an embodiment of the present disclosure;

FIG. 18 is a perspective view illustrating a process of reworking thehollow shielding structure for different types of circuit elementsformed through the manufacturing method of FIG. 15 from a PCB andforming a shield dam again according to an embodiment of the presentdisclosure;

FIG. 19 is a plan view illustrating an example that a tape type shieldcover is attached to a shield dam according to an embodiment of thepresent disclosure;

FIG. 20 is a cross-sectional diagram illustrating the tape type shieldcover attached to the shield dam taken along line X-X of FIG. 19according to an embodiment of the present disclosure;

FIG. 21 is a cross-sectional diagram illustrating an example that anadhesion unit is applied in a state that a tape type shield cover isplaced in a shield dam according to an embodiment of the presentdisclosure;

FIG. 22 is a perspective view illustrating a portable phone to which ahollow shielding structure for different types of circuit elements isapplied according to an embodiment of the present disclosure;

FIG. 23A is a perspective view illustrating a band type terminal towhich a hollow shielding structure for different types of circuitelements is applied according to an embodiment of the presentdisclosure;

FIG. 23B is a diagram illustrating an example that a shield dam isformed on a PCB disposed inside a band type terminal according to anembodiment of the present disclosure;

FIG. 24 is a perspective view illustrating an access point (AP) to whicha hollow shielding structure for different types of circuit elements isapplied according to an embodiment of the present disclosure;

FIG. 25 is a perspective view illustrating a tablet personal computer(PC) to which a hollow shielding structure for different types ofcircuit elements is applied according to an embodiment of the presentdisclosure;

FIG. 26 is a perspective view illustrating a portable digital camera towhich a hollow shielding structure for different types of circuitelements is applied according to an embodiment of the presentdisclosure; and

FIG. 27 is a schematic diagram illustrating another example of a groundpad formed in a PCB according to an embodiment of the presentdisclosure.

Throughout the drawings, like reference numerals will be understood torefer to like parts, components, and structures.

DETAILED DESCRIPTION

The following description with reference to the accompanying drawings isprovided to assist in a comprehensive understanding of variousembodiments of the present disclosure as defined by the claims and theirequivalents. It includes various specific details to assist in thatunderstanding but these are to be regarded as merely exemplary.Accordingly, those of ordinary skill in the art will recognize thatvarious changes and modifications of the various embodiments describedherein can be made without departing from the scope and spirit of thepresent disclosure. In addition, descriptions of well-known functionsand constructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are notlimited to the bibliographical meanings, but, are merely used by theinventor to enable a clear and consistent understanding of the presentdisclosure. Accordingly, it should be apparent to those skilled in theart that the following description of various embodiments of the presentdisclosure is provided for illustration purpose only and not for thepurpose of limiting the present disclosure as defined by the appendedclaims and their equivalents.

It is to be understood that the singular forms “a,” “an,” and “the”include plural referents unless the context clearly dictates otherwise.Thus, for example, reference to “a component surface” includes referenceto one or more of such surfaces.

It will be understood that when an element is referred to as being “on”or “in contact with” another element, it can be directly on or in directcontact with the other element or intervening elements may be present.In contrast, when an element is referred to as being “directly on” or“in direct contact with” another element, there are no interveningelements present. Other words used to describe the relationship betweenelements should be interpreted in a like fashion (e.g., “between” versus“directly between,” “adjacent” versus “directly adjacent,” etc.).

It will be understood that, although the terms first, second, etc. maybe used herein in reference to elements of the present disclosureregardless of an order and/or importance, such elements should not beconstrued as limited by these terms. The terms are used only todistinguish one element from other elements. For example, withoutdeparting from the spirit of the present disclosure, a first element mayrefer to a second element, and similarly, the second element may referto the first element.

It will be further understood that the terms “comprises” and/or“comprising,” when used in this specification, specify the presence ofstated features, integers, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, operations, elements, components, and/orgroups thereof.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which the present disclosure belongs.

The various embodiments of the present disclosure will be described toexemplify a hollow shielding structure for different types of circuitelements and the element used herein may be an element using a radiofrequency (RF) signal.

The element may be an element which employs technology standards orcommunication method for mobile communication, such as global system formobile communication (GSM), code division multi access (CDMA), CDMA2000,enhanced voice-data optimized or enhanced voice-data only (EV-DO),wideband CDMA (WCDMA), high speed downlink packet access (HSDPA), highspeed uplink packet access (HSUPA), long term evolution (LTE), orLTE-advanced (LTE-A).

The element may be an element which employs wireless internettechnology, such as wireless local area network (WLAN), Wi-Fi, Wi-FiDirect, digital living network alliance (DLNA), wireless broadband(Wi-Bro), or world interoperability for microwave access (WiMAX).

The element may be an element having a function such as short-rangecommunication (Bluetooth™), radio frequency identification (RFID),infrared data association (IrDA), ultra wideband (UWB), ZigBee, nearfield communication (NFC), Wi-Fi, Wi-Fi Direct, or wireless universalserial bus (USB).

A circuit element package according to an embodiment of the presentdisclosure may be applied to a smart phone, a display apparatus, awearable device, and the like.

A hollow shielding structure for different types of circuit elementsaccording to an embodiment of the present disclosure may include anintegrated circuit (IC) chip, a passive element, and different types ofcomponents mounted on a printed circuit board (PCB) and a shield layercovering the IC chip, the passive element, and the different types ofcomponents. For example, the IC chip may be an application processor(AP), a memory, an RF chip, and the like and the passive element may bea resistor, a condenser, a coil, and the like. The different types ofcomponents may be a connector, a card socket, an electromagnetic waveshielding component, and the like.

Hereinafter, a hollow shielding structure for different types of circuitelements and a manufacturing method thereof according to an embodimentof the present disclosure will be described in detail with reference tothe accompanying drawings.

FIG. 1A is a cross-sectional diagram illustrating a hollow shieldingstructure for different types of circuit elements according to anembodiment of the present disclosure.

Referring to FIG. 1A, a circuit element package 100, as a hollowshielding structure for different types of circuit elements, may includea PCB 110 and an element 113 and a plurality of circuit elements 117 and119 mounted on the PCB 110. The plurality of circuit elements may bedifferent types of circuit elements and may include an IC chip, apassive element, and different types of components mounted on the PCB.For example, the IC chip may be an application processor (AP), a memory,an RF chip, and the like and the passive element may be a resistor, acondenser, a coil, and the like. The different types of components maybe a connector, a card socket, an electromagnetic wave shield component,and the like.

A first connection pad 111 and a second connection pad 112 to which theelement 113 and the plurality of circuit elements 117 and 119 areelectrically coupled may be patterned in a top surface of the PCB 110. Aplurality of first connection pads 111 and a plurality of secondconnection pads 112 may be provided. The first and second connectionpads 111 and 112 may be formed to ground the element 113 and theplurality of circuit elements 117 and 119 or to transmit signals of theelement 113 and the plurality of circuit elements 117 and 119.

A ground pad 114 may be patterned on the top surface of the PCB 110. Theground pad 114 may be formed to ground the element 113 and the pluralityof circuit elements 117 and 119 or to transmit signals of the element113 and the plurality of circuit elements 117 and 119. For example, ashield dam 120 to be described later may be in electrical contact withthe ground pad 114, which is formed along a formation route of theshield dam or formed on a portion of the formation route of the shielddam, in response to the shield dam 120 being formed on the PCB 110, andthus the shield dam 120 may be grounded. In this example, the ground pad114 may be formed in an integral form so that the ground pad 114 may beelectrically coupled to a predetermined ground layer (e.g., the groundlayer 115″ of FIG. 27) formed an inner side of the PCB. The element 113may include a plurality of connection terminals 116 electrically coupledto the first connection pad 111 of the PCB 110. The plurality ofconnection terminals 116 may be formed through a ball grid array (BGA)manner such as a solder ball. However, the formation method of theconnection terminal 116 is not limited to the BGA manner and theconnection terminal 116 may be formed through various manners accordingto a lead type of the element 113, for example, quad flat no lead (QFN),plastic leaded chip carrier (PLCC), quad flat package (QFP), smalloutline package (SOP), and thin/shrink/thin shrink SOP(TSOP/SSOP/TSSOP).

Each of the plurality of circuit elements 117 and 119 may include atleast one connection terminal (not shown) electrically coupled to thesecond connection pad 112 of the PCB 110. The plurality of circuitelements 117 and 119 may have a height smaller than or larger than thatof the element 113 in response to the plurality of circuit elements 117and 119 being mounted on the PCB 110. The element 113 and the pluralityof circuit elements 117 and 119 may be disposed to be spaced from theshield dam 120 at intervals so as not to be in contact with the shielddam 120.

The hollow shielding structure or circuit element package 100 fordifferent types of circuit elements may include the shield dam 120, ashield cover 140, and an adhesion unit 150 on the PCB 110.

The shield dam 120, the shield cover 140, and the adhesion unit 150 maybe formed of a material having an electromagnetic wave shieldcharacteristic which may prevent electromagnetic interference (EMI).Accordingly, the shield dam 120, the shield cover 140, and the adhesionunit 150 may shield an electromagnetic wave generated from the element113 and the plurality of circuit elements 117 and 119 to prevent the EMIwhich affects other electronic components mounted on an electronicapparatus including the circuit element package 100 in advance. Theshield dam 120, the shield cover 140, and the adhesion unit 150 maybasically interrupt the electromagnetic wave noise or an obstacle suchas an abnormal operation to the electronic apparatus including thecircuit element package 100 and may prevent reliability of productionsfrom being degraded. A shield layer, for example, the shield dam 120 andthe shield cover 140 may prevent the electromagnetic wave noise, whichis inevitably generated in an operation process of the circuit elementpackage 100, from affecting to the outside.

In the hollow shielding structure or circuit element package 100 fordifferent types of circuit elements according to an embodiment of thepresent disclosure, the element 113 which receives and transmits an RFsignal may be insulated from the shield dam 120, the shield cover 140,and the adhesion unit 150 through the air. For example, in response toan insulating layer being formed as in the related art, since thedielectric constant of the insulating layer is different from that ofthe air, the change in the frequency characteristic may be caused.However, in response to the element 113 being insulated from the shielddam 120, the shield cover 140, and the adhesion unit 150 through the airin an embodiment of the present disclosure, the change in the frequencycharacteristic due to the difference of the dielectric constant may beprevented. Accordingly, the RF signal matching structure may not benecessary for various products employing the hollow shielding structurefor different types of circuit elements according to an embodiment ofthe present disclosure and thus fabrication cost may be reduced.

The frequency characteristic of the RF chip may be affected by parasiticimpedance around the RF chip. Accordingly, the designer may design theRF chip so that the intensity of a signal at a specific communicationfrequency is increased in consideration of impedance affected by a gapbetween the RF chip and the electromagnetic wave shielding structure andthe dielectric constant. Up to now, since the metal shield can is usedfor a shielding structure, the air may exist between the RF chip and themetal shield can. The dielectric constant in the gap between the RF chipand the meal shield can may be on the basis of the dielectric constantof the air (the dielectric constant of the air is 1). In response to thegap being filled with other materials (for example, a polymer insulatingmaterial and the like) other than the air, the dielectric constant(=2.5) may be increased, and the frequency characteristic may be changedfrom A to B as illustrated in FIG. 1B. Accordingly, the capacities ofthe resistor and the condenser around the RF chip may be changed tomaintain the same frequency characteristic as that in the related art.In response to change range of the capacity being increased, thecapacity of the element may be out of a standard capacity range. Sincethe impedance matching is newly performed on each portable phone todesign a plurality of portable phone models, the design complexity maybe increased. Accordingly, since the air gap is formed between theshield cover 140 (e.g., a metallic shield cover) and the RF chip (forexample, the element 113) in the hollow shielding structure or circuitelement package 100 for different types of circuit elements according toan embodiment of the present disclosure, the frequency characteristicmay be maintained without change of the related impedance design.

The shield dam 120 may form a lateral surface of the shielding structureand the shield cover 140 may form a top surface of the shieldingstructure.

The shield dam 120 may be grounded to the ground pad 114 in response tothe shield dam 120 being formed and the shield dam 120 may substantiallyhave a closed-loop shape to surround the element 113 and the pluralityof circuit elements 117 and 119. For example, the shield dam 120 may beformed in a rectangular shape, but this is not limited thereto. Theshield dam 120 may be formed through a three-dimensional (3D)-printablematerial discharge device (e.g., the material discharge device 200 ofFIG. 7). Since the material discharge device 200 is generallylower-priced than the semiconductor equipment of the related art forforming a semiconductor layer, the fabrication cost may be reduced, theshield dam 120 may be formed in a short time, and the required time forthe manufacturing process may be shortened.

A height h2 of the shield dam 120 may be formed larger than a height h1of the element 113 mounted on the PCB 110. To prevent the element 113from being electrically coupled to the shield cover 140, the height h2of the shield dam 120 may be set to have a fixed gap G between theelement 113 and the shield cover 140.

FIG. 2 is a schematic cross-sectional diagram illustrating an examplethat a height of a shield dam is formed lower than a height of awireless communication element mounted on a PCB according to anembodiment of the present disclosure.

Referring to FIG. 2, a height h3 of a shield dam 120′ may be formedsmaller than a height h1 of an element 113 mounted on the PCB 110. Asthe height of the shield dam is increased, it may be advantageous onprocess, but it is not easy to form the shield dam having a high height.Accordingly, the shield dam 120′ may be formed to have a lower heightand a step 147′ may be formed in a shield cover 140 to compensate thelowered height of the shield dam 120′. The elements having a largerheight than the shield dam 120′ may be covered with the shield cover 140with a fixed gap through the step 147′. In response to the height h3 ofthe shield dam 120′ being formed smaller than the height h1 of theelement 113, the processing time may be shortened.

The step 147′ of the shield cover 140 illustrated in FIG. 2 may beformed larger than the step 147 of the shield cover 140 illustrated inFIG. 1A and the electrical contact between the element 113 and theshield cover 140 may be prevented due to a fixed gap G between theelement 113 and the shield cover 140.

Through the formation of the step 147′ in the shield cover 140, theadhesion unit 150 may not be in contact with neighboring structures bylowering a height of the adhesion unit 150 than the height of a topplate 141 of the shield cover 140 and considering shapes of theneighboring structures. For example, in response to the hollow shieldingstructure for different types of circuit elements according to anembodiment of the present disclosure as illustrated in FIG. 2 beingapplied to a portable phone (e.g., the portable phone 410 of FIG. 22),the height of the adhesion unit 150 may be lowered to correspond to anedge portion 33 of a rear cover 30 of the portable phone which is formedlower than a central portion 31 of the rear cover 30. The rear cover 30of the portable phone may refer to a battery cover. Accordingly, theportable phone may be designed so that the adhesion unit 150 may not beinterfered with an inner surface of the rear cover 30. In response tothe circuit element package, according to an embodiment of the presentdisclosure, being applied to various types of small home appliances, thecircuit element package may be disposed in harmony with the shapes ofthe structures around the circuit element package and thus the freedegree in the design may be improved and an overall volume of theportable phone may be maintained in a compact size.

In an embodiment of the present disclosure, the shield dams 120 and 120′may be formed so that the heights h2 and h3 are larger than or smallerthan the height h1 of the element 113 as illustrated in FIGS. 1A and 2,and thus the fabrication may be flexible and the working efficiency maybe improved. The examples that the heights h2 and h3 of the shield dams120 and 120′ are formed larger than or smaller than the height h1 of theelement 113 have been described in the various embodiments of thepresent disclosure, but this is not limited thereto and the heights h2and h3 may be set equal to the height h1 of the element 113.

The shield cover 140 may be spaced from the elements 113, 117, and 119to form a fixed gap. An insulating space S in which the air exists maybe formed in an inner side of the shield cover 140 and the shield cover140 may have the fixed gap with the elements using the air as theinsulator. The insulating space S may be formed by the PCB 110, theshield dam 120, and the shield cover 140.

The element 113 and the plurality of circuit elements 117 and 119 andthe first connection pad 111 and the second connection pad 112electrically coupled to the elements 113, 117, and 119 may be located inthe insulating space S.

FIG. 3 is a diagram illustrating an example of an underfill treatmentbeing performed between a bottom surface of an element and a top surfaceof a PCB according to an embodiment of the present disclosure.

Referring to FIG. 3, to stably fix the element (for example, the element113) having a relatively large size among the elements 113, 117, and119, an underfill formation unit 118 may be located in the insulatingspace S between the element and the PCB through an underfill process. Asdescribed above, various structures other than the underfill formationunit 118 may be located in the insulating space S, but any structure maybe formed to have a fixed gap with the shield dam 120 and the shieldcover 140 using the air as an insulator.

FIG. 4 is a perspective view of the shield cover illustrated in FIG. 1Awherein the shield cover includes a plurality of slots, in which anadhesion unit flows, in a contact portion with a shield dam according toan embodiment of the present disclosure.

Referring to FIG. 4, the shield cover 140 may be formed of a conductivemetal material and may have an area corresponding to a shield region tocover the overall shield region. The shield cover 140 may be formed in aplate form having a fixed thickness and may have stiffness and ensurestructural stability.

The shield cover 140 may include a top plate 141 and a seating portion143 formed along a border of the top plate 141.

The top plate 141 may be substantially flat and may cover an upperportion of the shield region partitioned by the shield dam 120. At leastone air discharge hole 149 may be formed in the top plate 141 todischarge the air thermally expanded in the insulating pace S formed bythe PCB 110, the shield dam 120, and the shield cover 140.

FIG. 5A is a diagram illustrating an example that a hole is formed in ashield cover to prevent frequency interference of an element accordingto an embodiment of the present disclosure, and FIGS. 5B and 5C arediagrams illustrating examples that a hole and a step are formed inshield covers in response to a height of an element being larger thanthose of the shield covers according to various embodiments of thepresent disclosure.

Other holes for other purposes other than air discharge may be formed inthe shield cover 140. For example, referring to FIG. 5A, a hole 149 ahaving a fixed area may be formed in a portion of the top plate 141 ofthe shield cover 140 corresponding to a position of an element 119 a(for example, an oscillator) to prevent change in the frequencycharacteristic due to undesired capacitance generated between theelement 119 a and the shield cover 140.

In response to a height of an element 119 b used in a shield regionbeing larger than that of the top plate 141 of the shield cover 140 asillustrated in FIG. 5B, a hole 149 b may be formed so that the element119 b is not interfered with the top plate 141 of the shield cover 140.Like the element 119 b described above, in response to the height of anelement 119 b being larger than that of the top plate 141 of the shieldcover 140, the hole 149 b may not be formed and as illustrated in FIG.5C, the shield cover 140 may be formed to be stepped in a portion of thetop plate 141 corresponding to a position of the element 119 b asindicated by 148 and to protrude by a fixed height toward the outer sideof the shield cover 140. For example, an inner side of the steppedportion 148 may be formed to have a fixed gap with the element 119 busing the air as an insulator.

The seating portion 143 may be placed in an upper portion 120 a of theshield dam 120, and a step 147 may be formed in the seating portion 143to have a fixed height difference from the top plate 141. For example,the seating portion 143 may be formed in a position lower than the topplate 141. The top plate 141 and the seating portion 143 of the shieldcover 140 may be formed to have the step 147 and as illustrated in FIGS.1A and 2, the fixed gap G may be formed between the bottom surface 141 aof the top plate 141 and the top surface 113 a of the element 113. Asthe step 147 is formed between the top plate 141 and the seating portion143 of the shield cover 140, the circuit element package 100 may bemanufactured in a compact size. The step 147 may be formed throughmulti-stage bending and the circuit element package 100 may be morestructurally stable than the package having no step.

The seating portion 143 may include a first portion which is in contactwith the upper portion 120 a of the shield dam 120 and a second portion143 b substantially downwardly bent from an end portion of the firstportion 143 a. The shield cover 140 may be substantially placed in theshield dam 120 by the first portion 143 a. The second portion 143 b maybe in contact with a side portion 120 b of the shield dam 120 asillustrated in FIG. 1A, but this is not limited thereto and the secondportion 143 b may be spaced from the side portion 120 b of the shielddam 120 at a fixed interval.

The shield cover 140 may be electrically coupled to the shield dam 120by the adhesion unit 150. The adhesion unit 150 formed of a conductivematerial may be applied in the seating portion 143 of the shield cover140 and may flow in a plurality of slots 145 formed in the seatingportion 143 to be in contact with the shield dam 120. The adhesion unit150 may be applied to the seating portion 143 and then thermally curedto firmly bond the seating portion 143 and the shield dam 120.Accordingly, the shield cover 140 may be electrically coupled to theshield dam 120 and may be structurally stably fixed to the shield dam120. In an embodiment of the present disclosure, the adhesion unit 150may be cured through various methods such as a curing method usingultra-violet (UV), infrared (IR) and a halogen lamp, a natural curingmethod, or an oven curing method.

The plurality of slots 145 formed in the seating portion 143 may besimultaneously formed in the first portion 143 a and the second portion143 b of the seating portion 143. For example, the plurality of slots145 may be formed to pass through the first portion 143 a and the secondportion 143 b of the seating portion 143 and to include a corner portionin which the first portion 143 a and the second portion 143 b are incontact with each other. In this example, the plurality of slots 145 mayensure a sufficient area so that the adhesion unit 150 may flow in theplurality of slots in the applying of the adhesion unit 150.

FIG. 6 is a perspective view illustrating another example of the shieldcover illustrated in FIG. 4 according to an embodiment of the presentdisclosure.

Referring to FIG. 6, the air discharge hole (e.g., the air dischargehole 149 of FIG. 4) may not be formed in an upper plate 141′ of a shieldcover 140′. The shield cover 140′ may have shielding performance higherthan the shield cover 140 including the air discharge hole 149 in theupper plate 141′. However, at least one air discharge hole, whichdischarges heat generated in various elements according to the drivingof the circuit element package 100 to the outside of the shieldingstructure, may also be formed in the shield cover 140′.

For example, a seating portion 143′ of the shield cover 140′ may beformed to have a step 147′ with the upper plate 141′ and a plurality ofslots 145′ may be formed in the seating portion 143′. In this example,the plurality of slots 145′ may be formed only in a first portion 143 a′of the seating portion 143′ and may not be formed in the second portion143 b′. In response to the plurality of slots 145′ being formed only inthe first portion 143 a′ of the seating portion 143′, the plurality ofslots 145′ may be formed to have a size that the applied adhesion unit150 may smoothly flow in the plurality of slots 145′.

Hereinafter, a method of manufacturing a circuit element packageaccording to an embodiment of the present disclosure will besequentially described. Before the manufacturing method is described, aconfiguration of a material discharge device for forming a shield damand an adhesion unit formed in the circuit element package will be firstdescribed.

FIG. 7 is a block diagram illustrating a material discharge device forforming a shield dam and an adhesion unit of a hollow shieldingstructure for different types of circuit elements according to anembodiment of the present disclosure. The material discharge device maybe a 3D printer.

The example that the material discharge device 200 includes one nozzle216, but this is not limited thereto and a plurality of nozzles may beprovided. For example, a plurality of nozzles having discharge holeshaving different aspect ratios may be provided to form shield dams 120having different heights. Even in response to one nozzle being provided,the dams having the different heights may be formed by adjusting amoving speed of the nozzle and a discharge amount of a material.

Referring to FIG. 7, the material discharge device 200 may include adispenser 212 configured to discharge a fixed amount of material. Thedispenser 212 may include a storage chamber 211 configured to store amaterial and a nozzle 216 configured to discharge the material providedfrom the storage chamber 211 to outside.

The dispenser 212 may include an X-Y-Z-axis moving unit 231 configuredto move the nozzle 216 to X-axis, Y-axis, and Y-axis directions and arotation driver 219 configured to rotate the nozzle 216 to a clockwisedirection or a counterclockwise direction or to stop rotation of thenozzle 216. The X-Y-Z-axis moving unit 231 may include a plurality ofstep motors (not shown) configured to move the nozzle 216 to the X-axis,Y-axis, and Z-axis directions and may be coupled to a nozzle mountingunit (not shown) on which the nozzle is mounted to transfer drivingforces of the step motors to the nozzle 216. The rotation driver 219 mayinclude a motor (not shown) configured to provide rotation power and anencoder (not shown) configured to control a rotation angle of the nozzle216 by detecting the number of rotation of the motor. The X-Y-Z-axismoving unit 231 and the rotation driver 219 may be electrically coupledto the controller 250 and may be controlled through the controller 250.

The material discharge device 200 may include a route input unit or aninput unit 253 configured to directly input a moving route of the nozzle216 by the user.

The input unit 253 may be configured of a touch screen for touch inputor a key pad of the related art. The user may input the moving route ofthe nozzle through the input unit 253. The nozzle route may be inputonce and the input nozzle route data may be stored in a memory 251. Thenozzle route data may be corrected later. A process of inputting thenozzle route through the input unit 253 will be described below.

First, at least two reference marks indicated on the PCB loaded into aworking position may be imaged through a vision camera, a distancebetween two reference marks may be measured, and images for thereference marks and a distance value between two reference marks may bestored in the memory 251. In response to the PCB being a rectangularshape, two reference marks may be indicated at the upper left and lowerright of the PCB. The distance between two reference marks may besubstantially represented with a straight-line distance of the PCB in adiagonal direction.

For example, in response to the PCB being loaded into the workingposition, the user may move the vision camera to a position in which afirst reference mark of the upper left is located (for example, on thebasis of the center of the first reference mark or a portion of thefirst reference mark) through front, back, left, and right movingbuttons provided in the input unit 253 and then press a storage buttonprovided in the input unit 253. The controller 250 may calculatecoordinates X1, Y1, and Z1 of the first reference mark by calculating adistance of the first reference mark spaced from the preset origin(0,0,0) and store the calculated coordinates X1, Y1, and Z1 in thememory. The imaging position of the vision camera which moves togetherwith the nozzle may be offset at a fixed interval from the center of thenozzle. Accordingly, the X1, Y1, and Z1 coordinates of the firstreference mark may be calculated through the controller 250 inconsideration of the offset value. In response to a shoot button beingpressed by the user, the image of the first reference mark may be storedin the memory 251.

Subsequently, the user may move the vision camera to a position in whicha second reference mark of the lower right is located (for example, onthe basis of the center of the second reference mark or a portion of thesecond reference mark) through the front, back, left, and right movingbuttons provided in the input unit 253 and then press the storage buttonprovided in the input unit 253. The controller 250 may calculatecoordinates X2, Y2, and Z2 of the second reference mark by calculating adistance of the second reference mark spaced from the preset origin(0,0,0) and store the calculated coordinates X2, Y2, and Z2 in thememory. In response to the shoot button being pressed by the user, theimage of the second reference mark may be stored in the memory 251. Likethe process of calculating the coordinates X1, Y1, and Z1 of the firstreference mark described above, the coordinates X2, Y2, and Z2 of thesecond reference mark may also be calculated through the controller 250in consideration of the offset value.

Referring to FIG. 7, the controller 250 may calculate a distance betweentwo positions of the first and second reference marks using the detectedpositions of the first and second reference marks described above andstore the calculated distance in the memory 251.

Then, while the user moves the vision camera along a route of the shielddam to be formed on the PCB using the front, rear, left, and rightmoving buttons of the input unit 253, the user may confirm a real-timeimage imaged through the vision camera and input a plurality ofcoordinates located on the moving route of the nozzle. The correspondingcoordinate may be input in response to a coordinate input buttonprovided in the input unit 253 being pressed in a state that the visioncamera is located in any point of the moving route of the nozzle. Theinput coordinate may be stored in the memory 251.

The plurality of coordinates may include a coordinate (e.g., thecoordinate Ap of FIG. 8) at a point that the nozzle starts to dischargea material, a coordinate at a point that the nozzle stops to dischargethe material (in response to the shield dam being in a closed-loop form,the stop point may be disposed almost close to the stop point Ap.), andcoordinates for points (e.g., the coordinates for points Bp, Cp, Dp, Ep,and Fp of FIG. 8) that the nozzle changes the direction during movement(e.g., along distances A, B, C, D, E and F).

To program the moving route of the nozzle, the input unit 253 mayinclude a moving button configured to move the nozzle to a designatedcoordinate, a line button configured to provide a command which allowsthe nozzle to discharge the material and simultaneously to move, andvarious command buttons such as a rotation button configured to switchthe moving direction of the nozzle. The user may generate a moving routeof the nozzle by matching the command buttons with the coordinate and arotation speed.

In response to the moving route of the nozzle being programmed throughthe user as described above, the controller 250 may automatically formthe shield dam in the PCB by moving the nozzle along the moving routeand simultaneously discharging the material.

The nozzle route data input through the input unit 253 may be stored inthe memory 251. The controller 250 may move the nozzle along thepreviously input route by driving the X-Y-Z-axis moving unit 231 and therotation driver 219 according to the nozzle route data stored in thememory 251. The nozzle route data may include a distance that the nozzle216 moves to a straight direction along the top surface of the PCB 110and the rotation direction and angle of the nozzle 216.

It has been described in an embodiment of the present disclosure thatthe user directly inputs the moving route of the nozzle through theinput unit 253, but this is not limited thereto and the nozzle movingroute may be pre-stored in the memory 251. To correspond to patterns ofthe shield dams variously formed according to products, a plurality ofnozzle moving routes corresponding to the patterns may be pre-stored. Inaddition to the nozzle moving route, calibration information, referenceposition information of the nozzle, reference position information ofthe PCB, reference height information of the PCB, and the like may bepre-stored in the memory 251 through the input unit 253.

FIG. 8 is a diagram illustrating a moving route of a nozzle inputthrough an input unit provided in a material discharge device accordingto an embodiment of the present disclosure.

Referring to FIG. 8, the nozzle 216 may move along a route for formingthe shield dam by the nozzle moving route data, and a detailed examplewill be described below with reference to FIG. 8.

The nozzle 216 may be set to a coordinate corresponding to the startpoint Ap and linearly move to +Y-axis direction by an A section throughthe X-Y-Z-axis moving unit 231. The nozzle 216 may rotate 90 degrees atan end point Bp of the A section to a counterclockwise direction throughthe rotation driver 219 and then linearly move to an −X-axis directionby a B section through the X-Y-Z-axis moving unit 231. The nozzle 216may sequentially repeat the linear movement and rotation with respect tothe remaining B, C, D, E, and F sections through the X-Y-Z-axis movingunit 231 and the rotation driver 219 and in response to the nozzle 216being returned to the start point Ap, the route movement of the nozzle216 may be completed.

FIG. 9 is a diagram illustrating a discharge hole of a nozzle of amaterial discharge device through which a material for forming a shielddam is discharged according to an embodiment of the present disclosure.

Referring to FIG. 9, a first discharge hole 218 a may be formed in alower lateral surface of the nozzle 216 and a second discharge hole 218b is formed in a bottom surface of the nozzle 216 so that the nozzle 216moves and rotates through the X-Y-Z-axis moving unit 231 and therotation driver 219 and simultaneously discharges the material. Thefirst and second discharge holes 218 a and 218 b may communicate witheach other and thus the material may be simultaneously dischargedthrough the first and second discharge holes 218 a and 218 b.

The first discharge hole 218 a may have a rectangular shape similar to afinal cross-section of the shield dam 120 to form the shield dam havinga large ratio of a height h to a width w (hereinafter, referred to asaspect ratio). In an embodiment of the present disclosure, an aspectratio r of the first discharge hole 218 a may be represented with avalue that the height h of the first discharge hole 218 a is divided bythe width w of the first discharge hole 218 a. For example, the aspectratio r in an exemplary embodiment of the present disclosure may berepresented with the following Equation 1.

Aspect ratio (r)=h/w   Equation 1

As the aspect ratio of the first discharge hole 218 a is increased, theshield dam 120 may have a high aspect ratio structure that a width issmaller and a height is large. The height h of the first discharge hole218 a may be set to correspond to the height (e.g., the height h2 ofFIG. 1A) of the shield dam 120 and the height (e.g., the height h3 ofFIG. 2) of the shield dam 120′.

The nozzle 216 may move along the preset route (e.g., C as shown in FIG.9) and simultaneously discharge the material over the ground pad 114through the first and second discharge holes 218 a and 218 b to form theshield dam 120.

FIG. 10A is a diagram illustrating a state that a material for forming ashield dam is discharged through the nozzle illustrated in FIG. 9wherein a ground pad electrically coupled to a lower end of the shielddam is omitted according to an embodiment of the present disclosure.

Referring to FIG. 10A, the nozzle 216 may move along a route for forminga shield dam 120 and simultaneously discharge the material through thefirst and second discharge holes 218 a and 218 b. The shield dam 120having a fixed aspect ratio r according to the shape of the firstdischarge hole 218 a may be formed. The first discharge hole 218 a maybe disposed toward an opposite direction of the moving direction of thenozzle 216.

FIG. 10B is a diagram illustrating an example that a plurality of shielddams having different heights are formed using a single nozzle wherein aground pad electrically coupled to a lower end of the shield dam isomitted according to an embodiment of the present disclosure.

Referring to FIG. 10B, the nozzle 216 may move at a first speed andsimultaneously discharge the material with a first discharge amount toform a first shield dam 120 e having a height h2. Subsequently, thenozzle 216 may discharge the material with the first discharge amountand simultaneously move at a second speed larger than the first speed toform a second shield dam 120 f having a height h3 smaller than theheight h2. In another example, the nozzle 216 may discharge the materialwith a second discharge amount smaller than the first discharge amountand simultaneously move at the first speed to form the second shield dam120 f having the height h3 smaller than the height h2.

The shield dam having a desired height may be formed using the singlenozzle 216 by appropriately controlling the discharge amount of thematerial discharged from the nozzle 216 and the moving speed of thenozzle 216.

FIG. 11 is a cross-sectional diagram illustrating an example that ashield dam having different heights is formed in both sides of a PCBaccording to an embodiment of the present disclosure. FIG. 11illustrates an example that the shielding structure is almost similar tothe shielding structure of FIG. 1A and heights in a left portion and aright portion of the shield dam formed on a single route are differentfrom each other.

Referring to FIG. 11, the height of the right portion 122 of the shielddam may be formed larger than that of the left portion 121 of the shielddam. The left portion 121 and the right portion 122 of the shield dammay be formed on the same route and may be implemented by appropriatelycontrolling the discharge amount of the material and the moving speed ofthe nozzle while the nozzle moves along the route and discharges thematerial as described with reference to FIG. 10B.

A shield cover 140″ may be suitably modified to correspond to a heightdifference between the left portion 121 and the right portion 122 of theshield dam. For example, as illustrated in FIG. 11, a step may be formedin both sides of the shield cover 140″ so that the right portion of theshield cover 140″ may be formed higher than the left portion thereof.

The material discharge device 200 may supply the material for formingthe shield dam to the nozzle 216 from the storage chamber 211. Thematerial stored in the storage chamber 211 may be moved to the inside ofthe nozzle 216 through a moving screw (not shown) provided in an insideof the storage chamber 211. The controller 250 may control the dischargeamount of the material discharged from the nozzle 216 through control ofa rotation speed of the moving screw. The material discharged from thenozzle 216 may be continuously discharged in a section that the nozzlelinearly moves as well as in a point that the nozzle is rotated to formthe shield dam. It has been described in an embodiment of the presentdisclosure that the nozzle moving route for forming the shield dam is aclosed loop, but this is not limited thereto and the nozzle moving routemay be an opened loop. The nozzle 216 may linearly move or move along acurve having a fixed curvature.

Referring back to FIG. 7, the discharge hole of the nozzle 216 may oftenbe cleaned or newly replaced in the material discharge device 200 or anend portion of the nozzle which discharges the material may not often beaccurately matched with a preset setup position in the materialdischarge device 200. Accordingly, the material discharge device 200 mayinclude a nozzle position measurement sensor 232 which allows the nozzle216 to be set to the setup position.

The nozzle position measurement sensor 232 may include a vision cameraand may be disposed below the nozzle 216 at a fixed interval. Thecalibration of the nozzle may be performed to match the end portion ofthe nozzle with the origin of the nozzle by reading an end position ofthe nozzle through an image imaged through the nozzle positionmeasurement sensor 232, comparing the read end position with the nozzleorigin value pre-stored in the memory 251, and moving the nozzle 216 byX and Y values according to a comparison difference. The movement of thenozzle 216 may be performed through the movement of the nozzle mountingunit according to the X-Y-Z-axis moving unit 231.

Referring to FIG. 7, the material discharge device 200 may set the startpoint Ap of the nozzle 216 for material discharge by detecting a postureof the PCB in an X-Y plane in which the PCB is placed in response to thePCB being loaded into a position for forming the shield dam. To detectthe posture after the loading of the PCB, the material discharge device200 may include the PCB reference position measurement sensor 233 and aPCB height measurement sensor 234.

The PCB reference position measurement sensor 233 may be a sensorconfigured to determine a PCB loading regular position and may include avision camera. The PCB reference position measurement sensor 233 maydetect whether or not the PCB which is loaded into the working space toform the shielding structure is located in a preset position or maydetect a distorted difference from the preset position.

For example, in response to the PCB being loaded into the workingposition, the controller 250 may move the PCB reference positionmeasurement sensor 233 to the preset coordinate of the first referencemark, image the current first reference mark of the PCB, and determinewhether or not the PCB reference position measurement sensor 233 islocated in the regular position by comparing the currently imaged firstreference mark and a preset shape of the first reference mark.

In response to the PCB reference position measurement sensor 233 beingdetermined to be located in the regular position, the controller 250 maycalculate a position difference between the current coordinate of thefirst reference mark and a preset coordinate of the first referencemark. Subsequently, the controller 250 may calculate a positiondifference between a current coordinate of the second reference mark anda preset coordinate of the second reference mark through the same methodas the method of calculating the position difference in the coordinateof the first reference mark.

The controller 250 may measure a distortion degree that the PCBcurrently loaded is distorted to the left or right on the X-Y plane onthe basis of the Z-axis through the calculated position differences inthe coordinates of the first and second reference marks.

The distortion degree of the currently loaded PCB may be set to theoffset value and the controller 250 may apply the offset value to thecurrently loaded PCB by applying the offset value to the moving route ofthe nozzle preset through the input unit 253.

The PCB height measurement sensor 234 may be configured to measure atilt angle of the PCB tiled on the X-Y plane with respect to the Z-axis,for example, a degree distorted by a preset height and may include alaser sensor. The PCB height measurement sensor 234 may measure heightsfor arbitrary three points on the PCB to measure the height of the PCB.The controller 250 may calculate the height of the top surface of thePCB through the measured height values of the three points and calculatea value (for example, several hundreds of μm) of the end portion of thenozzle spaced from the PCB on the basis of the calculated heights.Accordingly, in response to the nozzle 216 being moved on the PCB toform the shield dam, the end portion of the nozzle may be maintained toa fixed height from a surface of the PCB and thus the nozzle may besmoothly moved without interference with the top surface of the PCB. Thematerial discharge device 200 may measure the height for the top surfaceof the PCB in real time through the PCB height measurement sensor 234during the movement of the nozzle 216. The controller 250 may comparethe height value measured in real time with the height value pre-storedin the memory 251. For example, the nozzle 216 may be interfered withthe top surface of the PCB in response to the measured height valuebeing smaller than the pre-stored height value. In this example, thecontroller 250 may stop the movement of the nozzle 216 and inform theworker of error occurrence by driving a predetermined alarm device (forexample, a speaker or a beacon light).

Referring to FIG. 7, the material discharge device 200 may include a PCBloading and unloading unit 235 configured to load the PCB into theworking position to form the shield dam and unload the PCB after theformation of the shield dam is completed.

The material discharge device 200 may include a heater 236 for PCB heatconfigured to increase a temperature of the PCB to a fixed value toshorten a dry time of the formed shield dam 120.

The material for forming the shield dam 120 may be formed of anelectroconductive material having electrical conductivity of 1.0E+04 S/mor more. The electroconductive material may contain an electroconductivefilter and a binder resin.

The electroconductive filler may include a metal such as Ag, Cu, Ni, Al,or Sn or may include a conductive carbon such as carbon nanotube (CNT)or graphite. The electroconductive filler may include a metal-coatedmaterial such as Ag/Cu, Ag/glass fiber, or Ni/graphite or may include aconductive polymer material such as polypyrrole or polyaniline. Theelectroconductive filler may be configured in any one of a flake type, aspherical type, a rod type, and a dendrite type.

The binder resin may include a silicon resin, an epoxy resin, a urethaneresin, or alkyd resin. The material for the shield dam 120 may furthercontain additives for improving other performance (for example, aviscosity agent, an antioxidant, a high-molecular surfactant, and thelike) and a solvent (for example, water, alcohol, and the like).

The material for the shield dam 120 may have high viscosity (about200,000 cP) so as to form the shield dam 120 having a high aspect ratior and to maintain the shape of the discharged material without flow ofthe discharged material in the forming of the shield dam or materialdischarge device 200. In response to the shield dam being formed usingthe material having the high viscosity, the aspect ratio and height ofthe shield dam may be increased.

Using the material having the high viscosity, even in response to aboth-sided PCB being turned over to form a shield dam in a rear sideimmediately after a shield dam is formed in a front side, the materialshape of the shield dam formed in the front side may be maintainedwithout the material flow. Accordingly, the entire working process maybe swiftly performed.

FIG. 12 is a cross-sectional diagram sequentially illustrating amanufacturing process of a hollow shielding structure for differenttypes of circuit elements of FIG. 1A according to an embodiment of thepresent disclosure, and FIGS. 13 and 14 are diagrams illustrating groundunits or pads according to various embodiments of the presentdisclosure.

Referring to item (a) in FIG. 12, the connection pads 111 and 112 andthe ground pad 114 may be patterned in the top surface of the PCB 110and the element 113 and the passive elements 117 and 119 as the circuitelement may be adhered to be electrically coupled to the connection pads111 and 112.

The ground pad 114 may be patterned in the PCB 110 in a discontinuoushidden line form as illustrated in FIG. 13. The ground pad 114 may beformed to surround the elements 113, 117, and 119 and an inner side ofthe ground pad 114 may be a shield region. The ground pad 114 may beintegrally formed with the ground layer 115 formed in the inner side ofthe PCE 110.

Referring to FIG. 14, a ground pad 114′ may be patterned in the PCB 110in a continuous solid line form. In response to the ground pad 114′being in the solid line form, the contact area of the ground pad withthe shield dam 120 may be increased and the electrical stability of theground pad being higher than the ground pad having the discontinuoushidden line form may be ensured. The ground pad 114′ may be integrallyformed with the ground layer 115 formed in the inner side of the PCB110.

Referring to item (b) in FIG. 12, the shield dam 120 may be formed inthe top surface of the PCB 110 to be in contact with the ground pad 114.The shield dam 120 may be formed substantially in a closed loop form tosurround the element 113 and the plurality of circuit elements 117 and119 along the ground pad 114. The shield dam 120 may be formed of aflowable material having high viscosity so that the shield dam is formedhigher than heights of the element 113 and the plurality of circuitelements 117 and 119.

Referring to item (c) in FIG. 12, the shield cover 140 may be placed inthe upper portion 120 a of the shield dam 120. The shield cover 140 mayhave the step 147 formed between the upper plate 141 and the seatingportion 143 to form a fixed air gap between the shield cover 140 and theelement 113. The shield cover 140 may be spaced from the remainingplurality of circuit elements 117 and 119 to form a fixed air gap. In anembodiment of the present disclosure, the elements 113, 117, and 119,for example, the element 113 may be insulated from the shield dam 120and the shield cover 140 through the air. Accordingly, unlike therelated art, the process for filling the inside of the cured shield dam120 with a separate insulating material may not be necessary and changein frequency characteristic due to the insulating material may bebasically removed. The structure for RF signal matching according to thechange in the frequency characteristic in products may not be necessaryand thus fabrication cost may be reduced and the fabrication process maybe shortened.

Referring to item (d) in FIG. 12, the adhesion unit 150 may be formed byapplying a material having conductivity and an electromagnetic waveshield characteristic along the seating portion 143 of the shield cover140 placed in the shield dam 120. The material for the adhesion unit 150may have fixed flowability and a portion of the material for theadhesion unit 150 may flow in the plurality of slots 145 formed in theseating portion 143 so that the material for the adhesion unit 150 maynot be spread to an undesired range but may be located in a desiredregion in the process of applying the material in a top surface of theseating portion.

A portion of the adhesion unit 150 may flow in the plurality of slots145 to be in contact with the shield dam 120 and the remaining portionthereof may be left in the top surface of the seating portion 143.

The adhesion unit 150 may electrically couple the shield cover 140 tothe shield dam 120 to expand the ground region from the shield dam 120to the shield cover 140 and thus the stable ground path may be provided.The cured adhesion unit 150 may structurally firmly fix the shield cover140 to the shield dam 120.

Hereinafter, a process of manufacturing a hollow shielding structure fordifferent types of circuit elements and a process of reworking theformed shielding structure from a PCB will be described in detail.

FIG. 15 is a perspective view sequentially illustrating a manufacturingprocess of a hollow shielding structure for different types of circuitelements according to an embodiment of the present disclosure. FIG. 16Ais a perspective view illustrating mounting equipment for mounting ashield cover on a PCB according to an embodiment of the presentdisclosure, FIG. 16B is a diagram illustrating a reel cartridge providedin the mounting equipment of FIG. 16A according to an embodiment of thepresent disclosure, and FIG. 16C is a diagram illustrating a pluralityof shield covers attached to a film unit of the reel cartridge of FIG.16B according to an embodiment of the present disclosure. FIG. 17 is adiagram illustrating an example that a shield cover is placed in ashield dam through a robot arm provided inside mounting equipmentaccording to an embodiment of the present disclosure. FIG. 18 is aperspective view illustrating a process of reworking the hollowshielding structure formed through the manufacturing method of FIG. 15from a PCB and forming a shield dam again according to an embodiment ofthe present disclosure.

A nozzle moving route may be input through a route input unit 253 of thematerial discharge device as a pretreatment process. If necessary, thematerial discharge device may set the nozzle to the origin and maylocate the nozzle in a start point for material discharge by detectingthe posture of the PCB loaded into a working position.

Referring to item (a) in FIG. 15, a shield dam 120 f may be formed in atop surface of a PCB 110 f along a ground pad 114 f to surround anelement 113 f and a plurality of circuit elements 117 f and 119 fmounted on the PCB 110 f using a dispenser 212 including a storagechamber 211 a and a nozzle 216 a. The shield dam 120 f may be formed ina height having a fixed aspect ratio.

Referring to item (b) in FIG. 15, a shield cover 140 f may be placed inan upper portion of the cured shield dam 120 f. The shield cover 140 fmay have a simple flat plate form without formation of a step unlike theshield covers 140 and 140′ as illustrated in FIGS. 4 and 6.

A plurality of slots 145 f may be formed at intervals along a borderportion of the shield cover 140 f. The plurality of slots 145 f may bearranged to form a closed loop corresponding to a shape of the shielddam 120 f.

In response to the shield cover 140 f being placed in the shield dam 120f, the plurality of slots 145 f may be arranged in a position that theupper portion of the shield dam 120 f is exposed.

After the PCB 110 f in which the shield dam 120 f is formed istransferred from the material discharge device to shield cover mountingequipment 20 illustrated in FIG. 16A, the process of placing the shieldcover 140 f in the shield dam 120 f may be performed.

A reel cartridge 21 may be mounted on one outer one side of the shieldcover mounting equipment 20. A film unit 23 may be rolled in the reelcartridge 21 in a state that a plurality of shield covers 140 f areattached on one surface of the film unit 23 at intervals. A transparentfilm configured to cover the plurality of shield covers 140 f may beprovided in the film unit 23 so that the shield covers 140 f are stablyattached to the film unit 23.

The reel cartridge 21 may supply the shield film to the mountingequipment 20. The shield film may be detached from the film unit 23through a predetermined separator in response to the shield cover beingsupplied to the inside of the mounting equipment 20 together with thefilm unit 23.

Referring to FIG. 17, the shield cover 140 f separated from the filmunit 23 may be transferred through a conveyor belt 170. A robot arm 41provided in the inside of the mounting equipment 20 may vacuum-adsorbthe shield cover 140 f carried on the conveyor belt 170 through anadsorption pad 43, move the shield cover 140 f to an upper side of theshield dam 120 f, and place the shield cover 140 f in an upper portionof the shield dam 120 f. The conveyor belt may be replaced with atransfer unit of the related art for transferring the shield cover 140f.

Referring to item (c) in FIG. 15, the mounting equipment 20 may includea separate dispenser D2 therein which includes a storage chamber 260configured to store a flowable material for the adhesion unit 150 f anda nozzle 261 configured to discharge the flowable material to a topsurface of the shield cover, for example, toward the slots 145 f to formthe adhesion unit 150 f.

The adhesion unit 150 f may be formed on the top surface of the shieldcover 140 f along the plurality of slots 145 f formed in the shieldcover 140 f using the prepared dispenser D2. Since the adhesion unit 150f is flowable, a portion of the material may flow in the slots 145 f tobe filled in the slots during the applying of the material and aremaining portion of the material may be formed on the top surface ofthe shield cover 140 f.

Referring to item (d) in FIG. 15, the adhesion unit 150 f dischargedalong the plurality of slots 145 f may be cured to have fixed hardnessthrough a curing treatment. The formed adhesion unit 150 f mayelectrically couple the shield dam 120 f and the shield cover 140 f toexpand the ground region from the shield dam 120 f to the shield cover140 f.

The adhesion unit 150 f may be discharged to the top surface of theshield cover 140 f in the process of forming the shielding structure,but this is not limited thereto. For example, before the shield cover140 f is placed in the shield dam 120 f, the adhesion unit 150 f may bedischarged along an upper portion of the shield dam 120 f and then theshield cover 140 f may be placed in the adhesion unit 150 f whilepressing with fixed pressure before the shield cover 140 f is cured. Theadhesion unit 150 f may be curing-treated in a state that the shieldcover 140 f is placed in the adhesion unit 150 f. In this example, it isnot necessary to separately form the plurality of slots 145 f in theshield cover 140 f.

The process of reworking the shielding structure may be performed ininverse order of the process of forming the shielding structure.

Referring to item (a) in FIG. 18, the adhesion unit 150 f may bedetached from the shield cover 140 f using a predetermined tool, forexample, a pincette 300. For example, the adhesion unit 150 f presentedin the plurality of slots 145 f may be detached.

Referring to item (b) in FIG. 18, after the adhesion unit 150 f isdetached from the shield cover 140 f, the shield cover 140 f may beseparated from the shield dam 120 f. Subsequently, the shield dam 120 fmay be detached from the PCB 110 f using the same method as the methodof detaching the adhesion unit 150 f using the pincette 300.

Referring to item (c) in FIG. 18, a residue constituting a portion ofthe shield dam 120 f may be left attached to the top surface of the PCB110 f which the shield dam 120 f is not completely detached therefrom.The residue may be scraped from the top surface of the PCB 110 f using apredetermined tool, for example, a paddle 310 to be easily removed fromthe PCB 110 f.

Referring to item (d) in FIG. 18, the shield dam 120 f may be formedagain along the ground pad 114 f using the dispenser D1 in a state thatthe shielding structure is reworked. Subsequently, the processes ofFIGS. 15B to 15D may be sequentially performed to form a new shieldingstructure.

In response to the shield dam 120 f and the adhesion unit 150 f beingformed using 3D printing, the previously formed shielding structure maybe easily reworked and the element 113 f and the plurality of circuitelements 117 f and 119 f may be reused.

FIG. 19 is a plan view illustrating an example that a tape type shieldcover is attached to a shield dam according to an embodiment of thepresent disclosure. FIG. 20 is a cross-sectional diagram illustratingthe tape type shield cover attached to the shield dam taken along lineX-X of FIG. 19. FIG. 21 is a cross-sectional diagram illustrating anexample that an adhesion unit is applied in a state that a tape typeshield cover is placed in a shield dam according to an embodiment of thepresent disclosure.

Referring to FIGS. 19 and 20, the shield cover 340 may be provided notin a metal plate form but in a conductive tape form. For example, aplurality of seating portions 343 which are placed in an upper portion320 a of a shield dam 320 may be formed along a border of the shieldcover 340. In this example, a space 345 may be provided between adjacentseating portions 343, and thus an adhesion unit (e.g., the adhesion unit350 of FIG. 21) may be applied even in the upper portion 320 a of theshield dam 320 in response to the adhesion unit 350 is applied along atop surface of the seating portion 343.

Referring to FIG. 20, the shield cover 340 may include a shield layer341 and an adhesion layer 342 formed in a bottom surface of the shieldlayer 341.

In response to the shield cover 340 being formed in the shield tapeform, it is difficult to maintain a fixed form of the shield cover, forexample, a flat plate form since the rigidity of the tape type shieldcover is very lower than that of the shield cover formed in a metalplate form.

Accordingly, the shield cover 340 may include a shape maintenance layer347 having a thin thickness and formed in a paper or film form tomaintain the form of the shield cover 340. The shape maintenance layer347 may be attached to one surface of the adhesion layer 342 in apeelable form.

Before the adhesion unit 350 is formed, the shield cover 340 may betemporarily attached to an upper portion of the shield dam 320 throughthe adhesion layer 342 as illustrated in FIG. 20. In response to theadhesion unit 350 being applied on the top surface of the shield cover340 along a formation route of the shield dam 320 in the temporarilyattached state, the shield cover 340 may be electrically coupled to theshield dam 320 and may be structurally rigidly fixed to the shield dam320 as illustrated in FIG. 21. For example, the shield dam 320 may beformed on a ground pad 314 to have a fixed aspect ratio.

Referring to FIG. 21, an element 313 and a plurality of circuit element317 and 319 may be shielded in a state to have a fixed gap with theshield dam 320 and the shield cover 340 through an insulating space Susing the air as an insulator. The element 313 includes a top surface313 a, and connection pads 311, 312 and connection terminals 316 may beprovided. The circuit element package according to the variousembodiments of the present disclosure may be applied to various types ofsmall home appliances as illustrated in FIGS. 22, 23A, 23B, 24, 25, and26.

For example, the circuit element package according to an embodiment ofthe present disclosure may be implemented on a PCB of a portable phone410 illustrated in FIG. 22 and a PCB provided in a band type terminal420 illustrated in FIG. 23A. The band type terminal 420 may include aPCB 110′ formed to have a fixed curvature as illustrated in FIG. 23B. Toimplement a shield dam 120 c on the PCB 110′, a nozzle 216′ may movewith maintaining a uniform gap from a top surface 110 a′ of the PCB 110′in consideration of the curvature of the PCB 110′. Accordingly, whilethe controller 250 may measure a height of the top surface 110 a′ of thePCB 110′ in real time through the PCB height measurement sensor 234, thecontroller 250 may adjust the height of the nozzle 216′ andsimultaneously move the nozzle 216′. The material discharged from adischarge hole 218′ of the nozzle 216′ may be formed to a desired heightalong the curvature of the PCB 110′.

The circuit element package according to the various embodiments of thepresent disclosure may be implemented on PCBs provided in communicationequipment such as an access point (AP) 430 illustrated in FIG. 24, atablet PC 440 illustrated in FIG. 25, and a portable digital camera 450illustrated in FIG. 26.

FIG. 27 is a schematic diagram illustrating another example of a groundpad formed in a PCB according to an embodiment of the presentdisclosure.

For clarity, it has been described in the various embodiments of thepresent disclosure that the ground pads protrude from surfaces of thePCBs, but this is not limited thereto. A ground pad 114″ may be formednot to protrude from a surface of a PCB 110″ and for example, a topsurface of the ground pad 114″ may be formed substantially to coincidewith the surface of the PCB 110″ as illustrated in FIG. 27. For example,the ground pad 114″ may be integrally formed with the ground layer 115″formed in the inner side of the PCB 110″.

While the present disclosure has been shown and described with referenceto various embodiments thereof, it will be understood by those skilledin the art that various changes in form and details may be made thereinwithout departing from the spirit and scope of the present disclosure asdefined by the appended claims and their equivalents.

What is claimed is:
 1. A hollow shielding structure for different typesof circuit elements, the hollow shielding structure comprising: aprinted circuit board (PCB) on which at least one element is mounted; ashield dam surrounding the at least one element; and a shield coverconfigured to: electrically couple to an upper portion of the shielddam, and cover the at least one element, wherein a gap is formed betweenthe at least one element and the shield cover.
 2. The hollow shieldingstructure as claimed in claim 1, wherein a step is formed in a portionof the shield cover.
 3. The hollow shielding structure as claimed inclaim 2, wherein the step is formed in a portion of the shield coverclose to the shield dam.
 4. The hollow shielding structure as claimed inclaim 2, wherein the step is formed along an edge portion of the shieldcover.
 5. The hollow shielding structure as claimed in claim 2, whereina height of the shield cover is smaller than that of the at least oneelement.
 6. The hollow shielding structure as claimed in claim 2,wherein the shield dam and the shield cover are electrically coupledthrough a conductive adhesion unit, and wherein the conductive adhesionunit comprises a material having an electromagnetic wave shieldcharacteristic which prevents electromagnetic interference (EMI).
 7. Thehollow shielding structure as claimed in claim 6, wherein a plurality ofslots in which the adhesion unit flows are formed in the shield cover.8. The hollow shielding structure as claimed in claim 7, wherein aplurality of seating portions comprises: a first portion in contact withthe upper portion of the shield dam, and a side of the shield dam and asecond portion bent from an edge of the first portion are formed in theshield cover, and wherein the plurality of slots is formed in theplurality of seating portions.
 9. The hollow shielding structure asclaimed in claim 8, wherein the plurality of slots is configured to:penetrate the first portion, or simultaneously penetrate the firstportion and the second portion.
 10. The hollow shielding structure asclaimed in claim 6, wherein the adhesion unit is located between theshield dam and the shield cover.
 11. The hollow shielding structure asclaimed in claim 1, wherein the shield cover comprises a conductivemetal material.
 12. The hollow shielding structure as claimed in claim1, wherein the shield cover comprises: a conductive tape attached to theshield dam; and a shape maintenance layer configured to maintain a shapeof the conductive tape.
 13. The hollow shielding structure as claimed inclaim 1, wherein at least one air discharge hole is formed in the shieldcover.
 14. The hollow shielding structure as claimed in claim 1, whereinthe shield dam comprises a conductive material, and wherein the shielddam is coupled to a ground pad formed in the PCB.
 15. The hollowshielding structure as claimed in claim 14, wherein the shield dam iscontinuously or discontinuously coupled to the ground pad formed in thePCB.
 16. The hollow shielding structure as claimed in claim 1, whereinthe shield dam comprises a shield dam formed through three-dimensional(3D) printing. and wherein the shield dam has an aspect ratio such thata height of a cross section in the shield dam is larger than a width ofthe cross-section.
 17. A hollow shielding structure for different typesof circuit elements, the hollow shielding structure comprising: aprinted circuit board (PCB) on which at least one element is mounted; ashield dam surrounding the at least one element; a shield coverconfigured to be spaced from a top of the at least one element andcovers the at least one element; and an adhesion unit configured toelectrically couple the shield dam and the shield cover, wherein a stepis formed in the shield cover so that a portion of the shield coverwhich is in contact with the shield dam is located lower than aremaining portion thereof.
 18. A method for manufacturing a hollowshielding structure for different types of circuit elements, the methodcomprising: loading a printed circuit board (PCB) on which the differenttypes of circuit elements are mounted into a working position;calibrating a position of a nozzle with respect to the loaded PCB;forming a shield dam on the PCB by discharging a material from thenozzle; placing a shield cover in an upper portion of the shield dam tocover the different types of circuit elements; and forming an adhesionunit which electrically couples the shield dam and the shield cover. 19.The method as claimed in claim 18, wherein the calibrating of theposition of the nozzle comprises: setting a discharge start position ofthe nozzle by detecting a distortion degree of the PCB on an X-Y planeto a clockwise direction or counterclockwise direction with respect to apreset manufacturing position; and setting a gap between a surface ofthe PCB and an end portion of the nozzle by detecting a distortiondegree of the PCB on the X-Y plane to a Z-direction.
 20. The method asclaimed in claim 18, wherein, after the forming of the adhesion unit,the method further comprises: removing the adhesion unit from the shielddam and the shield cover; separating the shield cover from the shielddam; removing the shield dam from the PCB; and removing a remainingportion of the shield dam attached to the PCB.